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Beijing Huapei Zhitong Technology Development Co., Ltd
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instrumentb2b>Produtos

Beijing Huapei Zhitong Technology Development Co., Ltd

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    Room 102, Door 2, Residential Building 8, Huayan Beili No.2 Courtyard, Chaoyang District, Beijing

Contato Agora

Wafer grinding machine

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Visão geral

Can be used for grinding and polishing III-V materials, II-VI materials, metals, ceramics, and optical fibers.

Detalhes do produto

Logitech PM6Precision TypepolishingMachine,The specific functional features are as follows:

ofcontrol system

PM6The system is controlled through innovative design and intuitive operationhighlightThat's rightprocessControllableAll functions and operations of polishingAll through touch screencomputer operationInterface processing,A complete menu setup andworkmanshipClear display of options on the screenMake process storage and retrieval operations more convenient.

PM6The system provides a polishing discThe speedBoth timing and swing functions are availableBy setting and controlling through the operation interface,The timer starts working during machine operation, and can be set when unattendedprocessing materialscompletetimemachineIt will be stoppedThe control system will send a message to the operatorreminder.

PM6The system is equipped with an auxiliary driving fixture swing arm to accelerate the grinding and polishing rate, improve accuracy and process repeatability.

Intuitive operating control system

Fast and efficient grinding/polishingplateEasy to disassemble, convenientQuick transition for users between different grinding and polishing processestransformationThis flexibility makesPM6System becomes limited in laboratory spacechoice.

hostwholeAnti corrosion designThe system can beUnder corrosive environmentwork